Fabrication of a model continuously graded co-electrospun mesh for regeneration of the ligament-bone interface.
Satyavrata Samavedi, C Olsen Horton, Scott A Guelcher, Aaron S Goldstein, Abby R Whittington
Index: Acta Biomater. 7(12) , 4131-8, (2011)
Full Text: HTML
Abstract
Current scaffolds for the regeneration of anterior cruciate ligament injuries are unable to capture intricate mechanical and chemical gradients present in the natural ligament-bone interface. As a result, stress concentrations can develop at the scaffold-bone interface, leading to poor osseointegration. Hence, scaffolds that possess appropriate mechano-chemical gradients would help establish normal loading properties at the interface, while promoting scaffold integration with bone. With the long-term goal of investigating regeneration of the ligament-bone interface, this feasibility study aimed to fabricate a continuously graded mesh. Specifically, graded meshes were fabricated by co-electrospinning nanohydroxyapatite/polycaprolactone (nHAP-PCL) and poly(ester urethane) urea elastomer solutions from offset spinnerets. Next, mineral crystallites were selectively deposited on the nHAP-PCL fibers by treatment with a 5× simulated body fluid (5× SBF). X-ray diffraction and energy-dispersive spectroscopy indicated calcium-deficient hydroxyapatite-like mineral crystallites with an average Ca/P ratio of 1.48. Tensile testing demonstrated the presence of a mechanical gradient, which became more pronounced upon treatment with 5× SBF. Finally, biocompatibility of the graded meshes was verified using an MC3T3-E1 osteoprogenitor cell line. The study demonstrates that graded meshes, for potential application in interfacial tissue engineering, can be fabricated by co-electrospinning.Copyright © 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Related Compounds
Related Articles:
1989-11-01
[Carcinogenesis 10(11) , 2119-22, (1989)]
Crystal Structure, Optical Properties of Molecular Crystals 1, 3-propanediol Bis (4-aminobenzoate). Xue RT, et al.
[Adv. Mater. Res. 1052 , 207-211, (2014)]
Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro-silver flakes and nano-silver spheres for electronic packaging. Cui HW, et al.
[Polym. Int. 62(11) , 1644-1651, (2013)]
Adhesion of a novel flexible epoxy molding compound and its molecular dynamics simulation. Cui HW, et al.
[Int. J. Adhes. Adhes. 35 , 50-54, (2012)]